上海新进半导体制造有限公司

职位：上海新进半导体制造有限公司2008年校园招聘
发布时间：2007-11-16
工作地点：上海
信息来源：上海交通大学就业网
职位类型：全职
职位描述
单位名称 上海新进半导体制造有限公司 所在地区 上海市

组织机构码 607427086 经济类型 【三资企业】外商独资 注册资金(万元) 0 货币类型 .

人事部门名称 人事部 通信地址 上海市徐汇区宜山路800号 邮编 200233

单位网站 ww***com[点击查看] 招聘网址

独立法人 代理中介 已验证 已禁用 有协议 有招聘 注册用户

单位简介，包括单位规模、主营业务等

上 海新进半导体制造有限公司 系一家外资控股管理的集成电路制造公司。公司采用Bipolar/CMOS/DMOS即BCD整合技术,为以功率模拟为主的集 成电路产品提供加工工艺,是中国首条6英寸、以Bipolar为主的半导体工艺生产线,目标成为中国最大的Mixed Signal、Power Management产品制造和工艺代工公司。 新进 拥有一支出色的管理队伍,包括众多来自美国硅谷、海外创业成功者及国内半导体业界人士。公司提供具 有竞争力的薪资、境外公司股票期权及良好的职业发展前景。

招聘信息及相关宣讲会

招聘公告主题 2008年校园招聘 招聘类别 全职

宣讲会地点 宣讲起始时间 宣讲结束时间

招聘内容 1. Design Engineer /设计工程师 2. System Engineer /系统工程师 3. Device Engineer /器件工程师 4. Circle Design Engineer/电路设计工程师 5. Product Engineer/产品工程师 6. Test Engineer/测试工程师 7. Assembly Engineer/封装工程师 8. Process Engineer/工艺工程师 9. Equipment Engineer/设备工程师 10. 目检工程师 (视力良好,1.0以上。) 简历投递方式: 请将中英文简历、学校推荐表、成绩单、身份证及相关证书复印件及一寸近照一张发送邮件或邮寄至: 地址:上海市宜山路800号 上海新进半导体制造有限公司 人力资源部 邮编: 200233 E-mail:hr-bcd@

相关链接 简历投递Email hr-bcd@

招聘面向对象 发布日期 2007.11.16

1. Design Engineer /设计工程师

Responsibilities:

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Perform circuit design, analysis, verification and support to layout designers to meet product specifications and application requirements.

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Work with project leaders to complete the project accurately and timely and coordinate with other departments related to IC development.

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Participate in product evaluation work and continuously acquire advanced technical skills and design methodology.

Requirements:

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Master or above in Microelectronics-related fields with knowledge of IC design and semiconductor device physics.

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Teamwork spirit and good communication skills in both Chinese and English.

2. System Engineer /系统工程师

Responsibilities:

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Evaluate the engineering samples of new products based on the device level and the system level.

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Perform definition, promotion of new product.

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Prepare technical materials, demo prototypes, devices simulation model and total system solutions.

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Work with FAE to solve system application related issues in end customer side.

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Continuously improve individual technical capability and maintain a solid understanding of system application of end customers and competitors.

Requirements:

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Master or above in EE, Power Electronics preferred.

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Knowledge of circuit design tools, such as PCB layout (Cadence/OrCad), circuit simulation (Pspice, SIMPLIS, Saber), and mathematics analysis (Mathcad).

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Good command of both Chinese and English.

3. Device Engineer /器件工程师

Responsibilities:

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Response for establishment, characterization and validation of device modeling library, device structures and technology-related design rules/files.

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Provide technical support on design quality, ESD protection devices to design engineer and layout engineer.

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Continually acquire advanced knowledge on device physics and technology.

Requirements:

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Master or above in semiconductor physics.

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Knowledge of Semiconductor physics, device simulation, layout design.

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Good command of both Chinese and English.

4. Circle Design Engineer/电路设计工程师

Responsibilities:

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Perform circuit design, analysis, verification and support to layout designers to meet product specifications and application requirements.

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Work with project leaders to complete the project accurately and timely and coordinate with other departments related to analog IC development.

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Participate in product evaluation work and continuously acquire advanced technical skills and design methodology.

Requirements:

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BS or above in Microelectronics/Electronics fields.

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Teamwork spirit and good communication skills in both Chinese and English.

5. Product Engineer/产品工程师

Responsibility:

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Set up, implement and evaluate related Test plan issue.

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Arrange Reliability Test (Burn in/ Package Qual./ESD/Latch etc.)

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Characterization for the results of CP test and FT test.

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Related Cost down projects (Yield improvement /Molding compound/ Bound wire/ test time/Optimize test plan).

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Handle PDR/NCR on time.

Requirements of职位5/6/7/10:

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BS in Microelectronics/Electronics fields.

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Good command of English and PC operation, good communication skill and team player.

6. Test Engineer/测试工程师

Responsibility:

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Handle design release to full release process (Test plan review and Arrange Reliability Test (Burn in/ Package Qual./ESD/Latch etc. Characterization for the results of CP test and FT test.).

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Mass production project management:

a. Handle PDR/NCR on time.

b. Related Cost down projects (Yield improvement /Molding compound/ Bound wire/ test time/Optimize test plan).

7. Assembly Engineer/封装工程师

Responsibility:

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Work out ABS in time to meet the requirement of Design and Marketing Dept.

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Set up packing specification based on P/N to meet customer requirement.

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Perform special control to meet the special request from sales or customer.

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Conduct related experiments for cost down or yield improvement to reach company target.

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Build ECN internal and notice subcontractor to get them fully understanding.

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Source and assistant new suppliers to help them meet BCD s requirement and get finial qualification.

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Communicate with vendor to get technical fully support.

8. Process Engineer/工艺工程师

职责:

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解决生产线上工艺问题，建立OCAP，确保顺利流片。

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建立新工艺，验证新材料，以满足产品开发，降低成本等方面的要求。

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改善工艺控制，用SPC和相关统计方法，提高工艺参数Cpk。

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协助相关部门，提高良率和产品品质，不断优化工艺，提高产能。

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验证新设备并释放生产。培训工艺技术员和生产作业人员。

要求:

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材料/物理/化学/微电子专业本科学历。

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具备较强的团队合作和相互沟通，分析和解决问题的能力。可接受轮班。

9. Equipment Engineer/设备工程师

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保证设备的正常运行，为工艺生产提供稳定的设备状态，24小时待命。

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有效的解决设备出现的各种故障，减少设备的停机时间。

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实施设备预知性维修，改善工作质量，保持设备的性能状态，提高设备的UPTIME。

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协助工艺人员，优化生产工艺，确保工艺的稳定性。

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培训PM人员，使其能正确熟练的进行设备PM工作，处理一般常见的设备故障。

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负责设备相关文件的拟定、修改。负责制定备件申购计划，跟踪备件状况。

要求:

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机械/电子等相关专业本科学历。

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具备较强的动手能力，团队合作能力。可接受轮班。

10. 目检工程师 (视力良好,1.0以上。)

职责:

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制定并维护成品硅片出厂目检标准。

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根据成品硅片出厂检验规范和目检标准指导目检技术员/操作工进行日常的成品硅片表观质量检验。

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对目检技术员/操作工难于判断的硅片进行复查。

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对于较大的涉及两个或两个以上工艺段的表面异常，与MODULE工程师一起进行分析。

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定期完成报废片统计及异常分析报告。

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定期完成缺陷密度模式的统计及异常分析报告。

简历投递方式：

请将中英文简历、学校推荐表、成绩单、身份证及相关证书复印件及一寸近照一张发送邮件或邮寄至：

地址：上海市宜山路800号 上海新进半导体制造有限公司 人力资源部 邮编： 200233
E-mail：hr-bcd@