[上海]上海新进半导体制造有限公司2010招聘

发布时间：2009-09-28
工作地点：上海
信息来源：东南大学
职位类型：全职
职位描述
公 司 简 介

BCD Semiconductor Manufacturing Limited(简称BCD)是由美国和亚洲多家知名基金公司投资，于2000年9月正式成立，战略性地将总部设立在上海，是一家集设计研发、工艺制造、方案整合为一体的提供全方位电源管理IC解决方案的集成电路产品公司(IDM)。

BCD Semiconductor Manufacturing Limited (“BCD”) was founded by world-renowned venture capital funds from the United States and Asia in Sep.2000, BCD strategically headquartered in Shanghai, China, is an Integrated Device Manufacturer (IDM) that incorporates product development, process integration, and manufacturing capabilities to offer a wide range of power management IC solutions to its customers.

公司广泛的电源管理IC产品组合锁定在高增长、高价值的市场应用， 如手机、便携式媒体播放器、液晶电视和显示器、个人电脑、适配器和充电器以及其他电子产品。作为一家IDM公司,BCD半导体藉由产品设计和工艺技术的整合来优化产品的性能和成本。以自身产品为基础，公司可以根据客户对质量、性能和可靠性的不同要求提供各种应用系统的解决方案。

The company's broad portfolio of power management ICs primarily targets rapidly growing, high volume markets such as mobile phones, portable media players, LCD televisions and monitors, personal computers, adapters and chargers and other electronics products. As an IDM, BCD Semi integrates product design and process technology to optimize product performance and cost. The company offers system-level solutions with the quality, performance and reliability required by our customers.

公司现有全职员工980人，其中从事电路设计、工艺研发和产品工程的技术团队为250余人。BCD可以为系统客户提供采用先进的模拟IC设计和研发、以及利用高阶的生产工艺（如Bipolar、CMOS、BiCMOS 和BCDMOS等）所制造的电源管理产品。公司在中国上海、深圳、中国台湾和美国硅谷都设有销售办事处，销售代理商遍及全球。此外，BCD半导体总部已搬迁到上海紫竹科学园区，与国际知名公司英特尔和微软比邻。

The company currently employs 980 full-time staff, including more than 250 in IC design, technology development and product engineering. BCD Semi provides system customers with superior products that are developed with analog IC design and R&D, and manufactured with advanced process technologies such as Bipolar, CMOS, BiCMOS and BCDMOS, etc. The company has sales offices in Shenzhen, Taiwan and USA and has established distribution channels world-wide. The BCD Headquarters has relocated to Shanghai Zizhu Science-based Industrial Park; next to Intel and Microsoft.

公司始终以品质第一、客户第一为理念，成功地通过了ISO9001/2000、ISO14001及TS16949质量系统认证，并成为日本索尼的GP绿色伙伴。

BCD has long held the motto of “Customer First – Quality First.” And has successfully been accredited with ISO9001/2000, ISO14001 and TS16949 quality certificates and has also recently obtained a Sony GP Green Partner certificate

BCD 致力于成为全球领先的模拟信号IC解决方案供应商，正力求在全世界的市场范畴内为广大客户提供高性价比和高可靠性的优质产品。

BCD Semi strives to become a world leading analog/mixed-signal IC solution provider. The company is dedicated to achieving the goal of providing customers in the global market with most reliable products of the highest quality/price ratio.

现因业务发展所需，BCD下属子公司：上海新进半导体制造有限公司

面向社会，广纳贤士，共创BCD辉煌业绩，我们亦会不断努力，让BCD成为您再创职业辉煌的平台!

With fast business expansion, BCD’s subsidiaries, Shanghai SIM-BCD Semiconductor Manufacturing Ltd. sincerely invite talents to join us to create BCD’s prosperous future together.

BCD 2010 校园招聘岗位

序号 职位名称 学历要求 专业 要求

1 模拟集成电路设计工程师 硕士及以上 微电子/微电子学与固体电子学/电路与系统等 有模拟电路设计经验；熟悉Bipolar、BiCMOS或CMOS器件和工艺

2 电源管理芯片应用工程师 硕士及以上 电力电子与电力传动/电力电子/应用电子等 熟练掌握模拟及功率电路分析设计和仿真建模；英文良好；具备开关电源系统开发设计或应用经验者优先

3 电路设计工程师 硕士及以上 微电子/电子工程 掌握EDA软件

4 产品工程师 硕士及以上 微电子类 熟悉半导体器件，有 IC电路设计经验，掌握SPC

5 测试工程师 硕士及以上 微电子类 熟练掌握半导体知识，有电路测试相关经验优先

6 静电释放工程师, 硕士及以上 半导体物理学/电子类 掌握半导体物理、器件、设计基础知识

7 版图设计工程师 本科及以上 半导体物理学/电子工程或微电子相关专业 掌握半导体基础知识；熟悉EDA工具

8 工艺整合工程师 本科及以上 微电子类 掌握半导体基础知识，有工艺整合经验优先

以上职位工作地点均在 上海。

以上职位需要良好的英语能力和计算机操作能力；良好的协调沟通能力及团队精神。

应聘申请方式：

1. 请将您的，成绩单，相关证书等编辑邮件发送至hr-bcd@ 和 htang@；

2. 邮件名称请按照此格式；

3. 简历投递截至日期：2009年10月31日

招聘流程：

简历收集/筛选―――电话面试初选（人力资源/技术部）―――面试复选（至上海公司）―――

发放录用通知书―――签订三方就业协议

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公司名称：上海新进半导体制造有限公司 公司行业：电子技术/半导体/集成电路

公司性质：外资 公司规模：1000人 公司网站：ww***com[点击查看]

公司地址：上海紫竹科技园区紫星路1600号 / 上海徐汇区宜山路800号

联系人： 人力资源 唐小姐/张小姐

BCD 2010 校园招聘职位说明

1. Analog Design Engineer /模拟集成电路设计工程师

Responsibilities:

w Perform circuit design, analysis, verification and support to layout designers to meet product specifications and application requirements.

w Work with project leaders to complete the project accurately and timely and coordinate with other departments related to IC development.

w Participate in product evaluation work and continuously acquire advanced technical skills and design methodology.

Requirements:

w Master or above in Microelectronics-related fields with knowledge of IC design and semiconductor device physics.

w Teamwork spirit and good communication skills in both Chinese and English.

2. Application Engineer(Power management )/电源管理芯片应用工程师

Responsibilities:

w Evaluate the engineering samples of new products based on the IC level and the power system level.

w Perform definition, promotion of new power IC.

w Prepare technical materials, demo prototypes, devices simulation model and total system solutions of power IC.

w Work with FAE to solve power system application related issues in end customer side.

w Continuously improve individual technical capability and maintain a solid understanding of power system application of end customers and competitors.

Requirements:

w Master or above in EE, Power Electronics preferred.

w Knowledge of circuit design tools, such as PCB layout (Cadence/OrCad), circuit simulation (Pspice, SIMPLIS, Saber), and mathematics analysis (Mathcad).

w Good command of both Chinese and English.

3. Circle Design Engineer/电路设计工程师

Responsibilities:

w Perform circuit design, analysis, verification and support to layout designers to meet product specifications and application requirements.

w Work with project leaders to complete the project accurately and timely and coordinate with other departments related to analog IC development.

w Participate in product evaluation work and continuously acquire advanced technical skills and design methodology.

Requirements:

w Master or above in Microelectronics/Electronics fields.

w Teamwork spirit and good communication skills in both Chinese and English.

4. Product Engineer/产品工程师

Responsibility:

w Set up, implement and evaluate related Test plan issue.

w Arrange Reli, ability Test (Burn in/ Package Qual./ESD/Latch etc.)

w Characterization for the results of CP test and FT test.

w Related Cost down projects (Yield improvement /Molding compound/ Bound wire/ test time/Optimize test plan).

w Handle PDR/NCR on time.

Requirements:

w Master in Microelectronics/Electronics fields.

w Good command of English and PC operation, good communication skill and team player.

5. Test Engineer/测试工程师

Responsibility:

w Test program and hardware maintenance

w Wafer sort line support

w Abnormal yield analysis

w Testing efficiency improvement

Requirements：

w Master in Microelectronics/Electronics fields.

w Good command of English and PC operation, good communication skill and team player.

6. ESD Engineer (静电释放工程师)

Responsibility:

w Response for establishment, characterization and validation of ESD device library,

w ESD device structures and ESD design rules/files.

w Provide technical support on design quality, ESD protection devices to design engineer and layout engineer.

Requirements：

w Master or above in semiconductor physics.

w Knowledge of Semiconductor physics, device simulation, layout design.

w Good command of English and PC operation, good communication skill and team player.

7. Layout Engineer /版图设计工程师

岗位职责：

w 从事模拟及模拟混合信号集成电路版图设计；

w 完成从晶体管，功能模块到整个top的layout 设计；

w 后端物理验证，进行layout的DRC/LVS/LVL等相关验证。

任职要求：

w 本科及以上学历，半导体物理/电子工程或微电子相关专业；

w 掌握半导体基础知识，理解晶体管、电阻、电容、二极管等基本特性；

w 熟悉诸如 Cadence Virtuoso and Composer, Calibre, Mentor等EDA工具；

w 有较好的沟通技巧和团队合作精神。

8. Process Integration Engineer/工艺整合工程师

岗位职责：

w 负责公司新工艺的开发；

w 解决工艺开发过程中的相关技术问题。

任职要求：

w 本科及以上学历，微电子等相关专业；

w 良好的英语和计算机操作能力。