飞索半导体（中国）有限公司校园招聘会

发布时间：2007-09-20
工作地点：其它
信息来源：西北工业大学就业网
职位类型：全职
职位描述
招聘单位：索半导体（中国）有限公司校园招聘会

时间：2007年10月29日14:00 至 16:00

地点：西北工业大学

“2007亚洲最佳雇主”（第1名）--飞索半导体（中国）有限公司诚邀您的加盟! 飞索半导体是全球最大的专门提供闪存解决方案的高科技企业，为客户提供了最丰富、最全面的闪存产品线。飞索通过致力于为汽车、消费电子、网络和无线市场创建、保存和保护数字内容，从而，支持全球社会更加移动化、数字化和丰富多彩。公司在NASDAQ公开上市（代码[SPSN]）。我们拥有世界领先的”MirrorBit” 技术。总部位于美国桑尼维尔，全球现有员工约9400人。我们在苏州设有最先进的封装和测试基地,并在苏州和北京设有设计中心，在北京、上海和深圳设有销售和营销机构。 飞索（中国）有限公司作为飞索半导体的独资子公司，位于苏州工业园区一期启动区内，是飞索的制造和研发中心，批准投资额为2.16亿美元，现有员工1300人。我们拥有世界上最先进的IC封装和测试设备，以及开发实验环境。其具有业界领先科技的MCP（多层芯片）技术已经实现6层芯片的封装，并且具备更轻薄、更微小的工艺和开发条件。 在科技领先的同时，飞索提供有竞争力的薪酬，并且积极为员工营造“快乐”的企业文化，倡导“工作着，快乐着”的大家庭氛围。依靠敬业的员工团队，飞索在翰威特亚洲最佳雇主的评选中，荣膺2007中国最佳雇主和亚洲最佳雇主榜首。 欢迎各位勇于面对挑战的菁英加盟，带上你的事业梦想和飞索一起腾飞！ 飞索半导体公司在苏州成立设计中心简介 飞索是全球最大的专注于Nor型闪存解决方案的半导体公司。随着全球半导体产业持续向亚太地区转移，中国已成为世界上经济发展最快的国家，并且在可见的未来将继续保持这种增长。为了满足当前和未来中国及亚洲客户的需求，飞索战略性地在中国苏州设立了全球第六个研发中心。 该研发中心初期投资约520万美元，并计划未来三年内的总投资达2300万美元。到2010年设计研发人员将达50人。中心将充分利用飞索先进的深度微米半导体制工艺技术，围绕具有独立知识产权的MirrorBit或QuadBit NOR型大容量闪型存储器，重点开发和设计片上系统芯片，使闪存，微控制器，应用接口控制电路等模块无缝集成在单一硅晶片上，同时配合相应应用软件，给客户提供一套完整的芯片应用系统解决方案。 该中心的成立，旨在通过以客户需求为本，向客户提供成本效益最佳的系统解决方案，提高飞索产品在中国和亚太地区不断增长的市场中的竞争力。 校园招聘会宣讲时间： 2007年10月29日下午 14:00-16:00 宣讲地点： 航空楼D座环形报告厅 招聘职位：IC Design Center Positions: 1. IC Design EngineerRequirements: MS or PhD degree in Microelectronics/Computer Engineering/Digital Communication or related engineering field Solid understanding of computer architecture, MCU (8051, ARM), digital logic, analog design basics and fundamentals of IC design flow Excel in digital logic design, verilog/VHDL, and MCU related courses Basic knowledge of flash or novitiate memory is desirable, but not manatory Programming experience in C/C++, Assembly, and Perl, Tcl, Cshell or other shell scripting languages Knowledge of Vera, SystemC or SystemVerilog is a big plus School project experience in IC design/verification or validation in FPGA is a plus Self-motivated, detail-oriented, a quick learner and a good team player Verilog or VHDL RTL coding and synthesis Exceptional Oral and Written communication skills Fluent in both oral and written English Responsibility: Architectural and RTL design of complex, multi-million gate ASICs Simulation and verification functional modules, synthesis, static timing analysis, and physical floorplanning Additional responsibilities may include design validation on FPGA platform, and interface with engineers in analog, backend, firmware/software, system engineering teams and marketing teams… 2.IC Backend EngineerRequirements: Minimum BS degree in Microelectronics/Computer Engineering/Digital Communication or related engineering field Understanding of computer architecture, MCU (8051, ARM), digital logic or analog design basics a plus Understanding of fundamentals of IC design flow Excel in digital logic design, verilog/VHDL, and MCU related courses Basic knowledge of flash or novitiate memory is desirable, but not manatory Programming experience in C/C++, Assembly, and Perl, Tcl, Cshell or other shell scripting languages a plus Self-motivated, detail-oriented, a quick learner and a good team player Strong written and verbal communication skills. Exceptional Oral and Written communication skills Fluent in both oral and written English a plus Responsibility: Floorplanning, gate placement, clock tree design and implementation Power grid design and implementation, routing, physical verification (LVS/DRC) On-chip signal integrity analysis (EM, IR drop, xtalk, antennas, etc.), and GDSII generation Additional responsibilities include working closely with logic designers to enable physical synthesis based on the floor-planning 3.Application EngineerRequirements: Minimum Bachelor degree in Microelectronics, Computer Science/Engineering, Control Science/Engineering or related engineering fields. Programming experience in C/C++, Assembly, and Perl, Tcl, Cshell or other shell scripting languages Understanding of software engineering methodology Knowledge of computer architecture (e.g. 8051, ARM), embedded systems and FPGA a big plus Basic knowledge of flash or novitiate memory is desirable, but not mandatory Embedded hardware design/development or debugging experience a big plus Exceptional Oral and Written communication skills Fluent in both oral and written English Responsibility: · System application, middle ware and driver development on Linux/WinCE · Product specification, system verification/validation and support of key customers · Additional responsibilities may include failure analysis, and interface with IC design engineers 4. Firmware/Software EngineerRequirements: Minimum Bachelor degree in Microelectronics, Computer Science/Engineering, Control Science/Engineering or related engineering fields. Programming experience in C/C++, Assembly, and Perl, Tcl, Cshell or other shell scripting languages Understanding of software engineering methodology Knowledge of computer architecture (e.g. 8051, ARM), embedded systems and FPGA a big plus Basic knowledge of flash or novitiate memory is desirable, but not mandatory Embedded hardware design/development or debugging experience a big plus Exceptional Oral and Written communication skills Fluent in both oral and written English Responsibility: · System/software architecture design, product specification, hardware & software co-design · System & software development, verification, FPGA validation and system level test and release to production, and working very closely with IC design teams in New Production Introduction · Additional responsibilities may include customer support, failure analysis, and interface with IC design engineers, and marketing teams Note：1.欢迎各位同学登陆公司网站查阅相关信息：ww***com[点击查看]2.从本信息发布之日起，公司将接收有意应聘以上职位的同学的简历，请在10月25日之前将您的中、英文简历发送到hr.suzhou@，并注明所应聘职位的名称3.请参加宣讲的同学带好中英文简历及相关证书、证件的复印件，我们将安排现场收取简历

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